Fluid Dispensing System for Electronic Components Sealing Encapsulating

Product Details
Customization: Available
After-sales Service: Provided
Precision: High Precision
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Number of Employees
92
Year of Establishment
2003-08-22
  • Fluid Dispensing System for Electronic Components Sealing Encapsulating
  • Fluid Dispensing System for Electronic Components Sealing Encapsulating
  • Fluid Dispensing System for Electronic Components Sealing Encapsulating
  • Fluid Dispensing System for Electronic Components Sealing Encapsulating
  • Fluid Dispensing System for Electronic Components Sealing Encapsulating
  • Fluid Dispensing System for Electronic Components Sealing Encapsulating
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Basic Info.

Model NO.
PGB-200
Condition
New
Certification
CCC, FDA, RoHS, ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Transport Package
Poly-Wood Case
Specification
700x700x100
Trademark
Daheng
Origin
China
HS Code
8424899990
Production Capacity
1000/Year

Packaging & Delivery

Package Size
100.00cm * 100.00cm * 100.00cm
Package Gross Weight
100.000kg

Product Description

Fluid Dispensing System For Electronic Components Sealing Encapsulating 

The machine will have two tanks for keeping Liquid A & B separately.
There are two sets of metering pumps inside the machine, draining out liquids individually from tank A & B. Liquid A & B mix with each other in the mixer pipe and dispensed out according to the programmable data .
Automatic glue mixing machine is mainly used for a two-component glue( Epoxy/ Silicone/PU,etc adhesive), automatic metering and mixing the ratio by two sets of high precision pumps, supply to a fully mixing design and then dispensing , dosing , dispensing the aimed products .

* Machine picture :
Fluid Dispensing System for Electronic Components Sealing Encapsulating
* Working principle :

Fluid Dispensing System for Electronic Components Sealing Encapsulating
* Applications : 
Reverse Sensor, Electronic Circuit Board, Electronic Ballast ,air Filters, LED products ,Electronic components,Crafts,Ads modules, Capacitors, Power supply, Transformer, end cap for filter, solar junction box ,Power module, Ignition coil, Sensor, Photovoltaic module, Photovoltaic inverter. Etc


Fluid Dispensing System for Electronic Components Sealing Encapsulating
* Applied materials :
Epoxies , Urethane(PU) or Silicone .
Two components glue, AB glue, AB part glue, silicone, epoxy resin, polyurethane;
All kinds of two-component mixed glues with required ratio, such as epoxy resin AB glue, polyurethane, silica gel, PU glue,flocking glue, paint, etc.

Fluid Dispensing System for Electronic Components Sealing Encapsulating
* Company profile :
Fluid Dispensing System for Electronic Components Sealing Encapsulating

Fluid Dispensing System for Electronic Components Sealing Encapsulating
*Certificates & Core technology 
Fluid Dispensing System for Electronic Components Sealing EncapsulatingFluid Dispensing System for Electronic Components Sealing Encapsulating

* Global activities
Fluid Dispensing System for Electronic Components Sealing Encapsulating
Fluid Dispensing System for Electronic Components Sealing Encapsulating

*Packing and delivery 
Fluid Dispensing System for Electronic Components Sealing Encapsulating

 

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