Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure

Product Details
Customization: Available
After-sales Service: Provided
Precision: High Precision
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Number of Employees
92
Year of Establishment
2003-08-22
  • Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
  • Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
  • Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
  • Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
  • Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
  • Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
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Basic Info.

Model NO.
VGB-450Q
Certification
CCC, CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Glue & Ratio
1:1 to 20:1, Epoxy, Silicone, PU, UV
Certificate
CE, SGS
Xyz Working Area
700*700*80mm
Flow Speed
0-66g/5s, or Customized
Additional Function
Heating, Vacuum, Self-Refilling, Self-Cleaning
Transport Package
Wood Box
Specification
1500x1200x1500mm
Trademark
DH
Origin
China

Product Description

Vacuum Dosing Systems for the Highly Precise Potting of Electronic Components Under Vacuum Pressure

We Daheng Automation specialize in different types of potting and dispensing system. No matter what your resin application requirements look like: we can do most of them in our fully equipped lab. We can handle 1- and 2-component polyurethanes, epoxies, acrylics, silicones, temperature, humidity and UV curing materials. They can be from low- to high-viscosity, filled or unfilled and even high abrasive for thermal conductivity.

Potting and encapsulation is the process of embedding electronic components & assemblies in a liquid resin (potting compounds) to protect them against rough environment conditions. Potting can be performed in atmosphere pressure or even under vacuum, if high voltage insulation and high temperature differences are needed. Encapsulation of parts will stop corrosion of metals and reduce damage caused by vibration and mechanical stress.



 Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure

More pictures :
Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure


Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum PressureVacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
CCD Vision Dispensing Systems: Revolutionizing accuracy and quality control, CCD vision dispensing systems integrate advanced imaging technology with precision dispensing capabilities. By providing real-time visual feedback and ensuring precise placement of materials, these systems optimize production processes and minimize waste.

AB Glue Machines: Versatile and robust, AB glue machines are the workhorses of adhesive application. Whether it's two-part silicone, polyurethane, or epoxy, these machines excel in metering, mixing, and dispensing a wide range of materials. With customizable configurations and automated features, they streamline production workflows and enhance product consistency.

2K Potting Technology: For applications requiring superior encapsulation and protection, 2K potting technology delivers unmatched performance. By combining two components precisely at the point of dispensing, this technology ensures thorough mixing and homogeneity, resulting in durable and reliable potting solutions.

Automated Dispensing Equipment: Embracing the era of Industry 4.0, automated dispensing equipment integrates seamlessly into smart manufacturing environments. Equipped with high-precision dispensing valves and robotic arms, these systems offer unparalleled efficiency and repeatability, optimizing production throughput and reducing labor costs.

Dynamic and Static Mixing Systems: Catering to diverse application requirements, dynamic and static mixing systems provide flexible solutions for a variety of materials. Whether it's high-viscosity adhesives or low-viscosity resins, these systems deliver precise mixing ratios and consistent results, ensuring optimal performance in every application.

Metering, Pouring, and Filling Equipment: From meter-mix dispensing machines to resin casting systems, the versatility of modern dispensing equipment knows no bounds. Whether it's sealing, filling, or casting, these machines offer precise control over material flow and dispensing parameters, empowering manufacturers to tackle even the most challenging applications with confidence. In conclusion, the landscape of dispensing and potting equipment is evolving rapidly, driven by advancements in technology and the ever-increasing demands of modern manufacturing. By embracing innovative solutions such as CCD vision systems, automated dispensing equipment, and dynamic mixing systems, companies can unlock new levels of efficiency, precision, and reliability in their production processes. As industries continue to push the boundaries of innovation, the role of advanced dispensing equipment will only grow in importance, shaping the future of manufacturing for years to come.
 

Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
1. Quantify metering system with high precision(±1-2%), suitable for middle to low viscosity two component material ratio .
2. Adapting foreign technology that further improved sealing position and metering in good accuracy.
3. Graphite sealing components ; stainless pump ; stainless connector ensure the pump with long lifespan and anti corruption .
4. Metering pump have Daheng high pressure and high precision double liquid valve , with vary sealing methods and adjustable retract function, that is convenient for glue valve cleaning and precision glue dispensing .
5. Controlling system can program resin dispensing in high precision and reserved many glue dispensing programs .
6.. Inset self-check controlling system module makes fault detection rapidly .
7. Through different collections of metering pumps realize the changeable ratio from 1:1 to 10:1 . 8. Keep steady dispensing design , the glue-amount can be adjusted from 0.5g/s~12g/s per single pump, ab pump dispensing amount can be set accordingly to ab ratio . 9.Double cylinder plunger pump's structure especially suitable for high additive ,high density materials . The lifespan is designed for 10 years .



Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
1.The mixing motor drive the blade to stir the glue evenly. The mixing process totally seal ; the double liquid valve and mixing pipe filled with glue that assured glue mixing without any air bubble;the valve through turn on-off the air-cylinder to keep glue suck well and prevent  glue from dropping .
2. Stirring motor speed is 2000r/m, which can fully stir glue evenly.
3. Mixing pipe is consumable that from Sulzer Mixpac MR13-12; as per machine downtime , the mixers should be cleaned or soaked in cleaning fluid.
4.Dynamic mixing with stirring detecting function(optional) that ensure glue mixing evenly .
5. Stainless design of the glue touch surface to capture more higher material compatibility .
6.Glue valve with flow-back prevent function that can prevent mixture from dropping when stop dispensing .
7. Sealing parts of rod shaft adopt imported parts to keep more higher durability .
8. The self-cleaning function make machine cleaning more easier that you needn't dis-assembly the parts to wash . Cleaning time and cleaning times could be set in the touch screen.

PLC Operation Controlling System

5.1 Dispensing volume is controlled by the speed of pump's motors ; Glue speed adjustable within the speed range .
5.2 Machine with detecting function that detect the speed and running time of pumps to ensure the ratio reliability.
5.3 Adjustable gluing-out volume make sure glue A/B dispense out at the same time from glue valve to get better glue mixing effect .
5.4 Machine with gel resistance calculator , which prevent the mixture curing inside .
5.5 You can set single gluing-out and steady gluing-out function to meet up with your different process requirement .
5.6 Whole machine system and function is controlled by Panasonic PLC and MGCS touch screen .
5.7 Reserved PLC communication interface, which easy connecting with outside device .
5.8 Equipped with a safety lock to prevent staff from wrong operation .

Application :



Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure

Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure
Potting&Encapsulation &Casting:
Electronics componnets , PCB board, Capacitor, power supply, transformer, ignition coil, E-motors ,reverse sensor, circuit board, filter products ,underwater parts, electronic ballast ,aviation parts, aerospace parts....

Corner of workshop :
Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure

After sales service :


1, Staff training Seller is responsible to provide machine's training including installation, debugging, maintenance to assured customer can totally use the operation skills and well acknowledge maintenance of machine .

Maintenance Service  

2.1Seller provide one year warranty period and support free maintenance service during warranty . Software upgrade service is provided for a long life time.  
2.2 In case parts of the machine become broken within the warranty because of non-artificial factors, we send you part replacement free, buyer pay for the shipment. Double-liquid valve should be bought at its cost price.
2.3If the parts of the machine become broken past warranty , the parts replacement should be shouldered by buyer.


Shipping&Delivery 

Vacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum PressureVacuum Dosing Systems for The Highly Precise Potting of Electronic Components Under Vacuum Pressure

 

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